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Soldering Techniques & Standards Flashcards

7 cards from real CIS practice questions. Tap to flip, then mark Knew It or Still Learning — missed cards come back until you master them.

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  1. According to IPC J-STD-004, what does a flux activity designation of 'ROL0' indicate?

    Answer: Rosin-based, low activity, no halide content

    ROL0 means Rosin (RO), Low activity (L), and halide content of 0% (0), per IPC J-STD-004 flux classification.

  2. What is the maximum acceptable solder mask intrusion into a solder joint on a through-hole component per IPC-A-610?

    Answer: Solder mask cannot reduce the minimum annular ring

    Solder mask intrusion is acceptable as long as it does not reduce the minimum required annular ring below acceptance criteria.

  3. In IPC-A-610, which condition describes a through-hole solder joint where solder fills less than 75% of the barrel but wetting is acceptable?

    Answer: Process Indicator

    A through-hole barrel fill between 50% and 75% (Class 3) or 25% and 75% (Class 1/2) with good wetting is classified as a Process Indicator.

  4. Which soldering iron tip shape is best suited for drag soldering fine-pitch SMT components?

    Answer: Chisel or hoof tip

    A chisel or hoof tip provides a large flat surface ideal for drag soldering multiple fine-pitch leads in one stroke.

  5. Per IPC J-STD-001, what is the minimum preheat temperature requirement when hand soldering Class 3 assemblies with components sensitive to thermal shock?

    Answer: Preheat is required to minimize thermal gradients; specific temperature per manufacturer specs

    IPC J-STD-001 requires preheat to minimize thermal shock but defers specific temperatures to assembly documentation and component/material specifications.

  6. What type of solder void is considered most critical and typically a defect in BGA joints per IPC-7095?

    Answer: Voids exceeding 25% of the ball diameter located at the interface

    IPC-7095 classifies voids greater than 25% of ball diameter, especially at the component or board interface, as defects that compromise joint reliability.

  7. Which cleanliness test method measures ionic contamination on a PCB assembly after soldering?

    Answer: ROSE (Resistivity of Solvent Extract) test

    The ROSE test (also known as the Omega-meter test) measures ionic contamination by dissolving surface residues in isopropyl alcohol/water and measuring resistivity change.