CIS CIS Acceptability Criteria & Defect Recognition

Question 1

According to IPC-A-610, a 'process indicator' is best described as:

Accepted Answer

An anomaly that does not affect form, fit, or function but warrants monitoring

Answer

A condition that causes immediate product rejection

Answer

A defect requiring mandatory rework before shipment

Answer

A critical safety hazard on the assembly

Question 2

What is the IPC-A-610 acceptability condition for a solder bridge between two conductors that should not be electrically connected?

Accepted Answer

A defect for all classes

Answer

Acceptable if the bridge is less than 0.5 mm wide

Answer

Acceptable for Class 1 only

Answer

A process indicator for Class 2 and 3

Question 3

For IPC Class 3, a lifted land (pad lifting from the board surface) on a through-hole component is:

Accepted Answer

A defect

Answer

Acceptable if solder joint strength is maintained

Answer

A process indicator requiring documentation

Answer

Acceptable if less than 25% of the land is lifted

Question 4

According to IPC-A-610, what is the maximum allowable percentage of a solder joint's height that may be voided for Class 2 SMT components?

Accepted Answer

25%

Answer

10%

Answer

50%

Answer

No voids allowed

Question 5

A 'cold solder joint' is characterized by:

Accepted Answer

A dull, grainy, or crystalline surface texture indicating insufficient heat during soldering

Answer

Excessive solder volume with good wetting

Answer

Solder that has been applied at temperatures below 100°C

Answer

A joint with missing flux residue

Question 6

For IPC Class 2, what is the minimum acceptable solder fill percentage for a through-hole component barrel?

Accepted Answer

75%

Answer

50%

Answer

100%

Answer

25%