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Electronic Assembly & Manufacturing Processes Flashcards

7 cards from real CIS practice questions. Tap to flip, then mark Knew It or Still Learning — missed cards come back until you master them.

Read the first 7 Electronic Assembly & Manufacturing Processes flashcards as text

  1. What SMT defect is caused by insufficient solder paste and results in an open circuit?

    Answer: Solder starved joint

    A solder-starved joint has insufficient solder volume, resulting in a weak or open electrical connection between component lead and pad.

  2. What does 'IPC Class 3' designation indicate about an electronic assembly?

    Answer: High-reliability electronics where failure is not an option

    IPC Class 3 applies to high-reliability products such as military, medical, and aerospace electronics where continued performance is critical.

  3. Which soldering alloy is the most commonly used RoHS-compliant lead-free solder?

    Answer: SAC305 (Sn96.5/Ag3.0/Cu0.5)

    SAC305 (96.5% tin, 3% silver, 0.5% copper) is the industry-standard RoHS-compliant lead-free solder alloy for most electronics assembly.

  4. In PCB assembly, what is the purpose of the solder paste inspection (SPI) step?

    Answer: Measure solder paste volume, area, and alignment before component placement

    SPI measures solder paste deposits after printing to catch printing defects before components are placed, preventing costly rework downstream.

  5. What ESD precaution must operators take before handling ESD-sensitive components?

    Answer: Ground themselves using a wrist strap connected to a common ground point

    A properly grounded wrist strap continuously dissipates static charge from the operator's body to prevent ESD damage to sensitive components.

  6. Which process involves passing a PCB through a vapor of boiling fluorocarbon fluid to achieve uniform soldering temperatures?

    Answer: Vapor phase (condensation) soldering

    Vapor phase (condensation) soldering uses the latent heat of condensing fluorocarbon vapor to uniformly heat all components on the PCB to soldering temperature.

  7. What is 'skewing' in SMT component placement?

    Answer: A component rotated out of its correct angular position on the pad

    Skewing is a placement defect where a component is rotated from its intended angular orientation, potentially reducing solder joint coverage.