Practice Test Geeks(CIS) Certified IPC Specialist Practice Test
← All CIS Flashcard Decks

Component Identification & Handling Flashcards

7 cards from real CIS practice questions. Tap to flip, then mark Knew It or Still Learning — missed cards come back until you master them.

Read the first 7 Component Identification & Handling flashcards as text

  1. What does a yellow triangle with a hand symbol on component packaging indicate?

    Answer: Electrostatic sensitive device (ESD)

    The yellow triangle with a hand symbol is the ESD sensitivity symbol per ESDA/JEDEC standards, indicating the device is susceptible to electrostatic discharge damage.

  2. Which component feature is used to identify pin 1 on a dual in-line package (DIP) IC?

    Answer: A notch or dot on the package body

    DIP ICs use a notch (indent) at one end or a dot near pin 1 on the package body to identify pin 1 orientation.

  3. What is the primary purpose of moisture barrier bags (MBB) used for electronic components?

    Answer: To protect moisture-sensitive components from humidity exposure

    Moisture barrier bags protect moisture-sensitive devices (MSDs) from absorbing ambient humidity, which can cause internal delamination or 'popcorning' during soldering.

  4. A component is marked '4R7' on its body. What does this marking represent?

    Answer: 4.7 ohms

    The 'R' in component markings indicates a decimal point, so '4R7' means 4.7 ohms — a standard EIA marking convention.

  5. When handling BGAs (Ball Grid Array packages), what is the primary concern regarding the solder balls?

    Answer: Physical contact can deform or contaminate the solder balls

    BGA solder balls are delicate; physical contact, pressure, or contamination from oils/skin can deform balls or leave residues that affect solder joint quality.

  6. What information does the lot code on an electronic component typically provide?

    Answer: Date of manufacture and production batch traceability

    Lot codes provide manufacturing traceability, typically encoding the date code and production batch, which is critical for quality control and failure analysis.

  7. According to IPC standards, what is the correct way to handle a component that has been dropped on the floor during assembly?

    Answer: Inspect it under magnification and scrap if damaged

    Dropped components must be inspected under magnification per IPC handling procedures; any damage or contamination requires scrapping the component to prevent assembly defects.