CIS Acceptability Criteria & Defect Recognition Flashcards

According to IPC-A-610, a 'process indicator' is best described as:

Answer: An anomaly that does not affect form, fit, or function but warrants monitoring

A process indicator is a condition that does not affect form, fit, or function but indicates the manufacturing process may be marginal and should be monitored.

What is the IPC-A-610 acceptability condition for a solder bridge between two conductors that should not be electrically connected?

Answer: A defect for all classes

A solder bridge creating an unintended electrical connection between conductors is a defect for all IPC classes (1, 2, and 3).

For IPC Class 3, a lifted land (pad lifting from the board surface) on a through-hole component is:

Answer: A defect

For IPC Class 3 high-reliability products, any lifted land is a defect because it compromises the reliability of the solder connection.

According to IPC-A-610, what is the maximum allowable percentage of a solder joint's height that may be voided for Class 2 SMT components?

Answer: 25%

IPC-A-610 allows up to 25% voiding by area in solder joints for Class 2 assemblies when inspected by X-ray.

A 'cold solder joint' is characterized by:

Answer: A dull, grainy, or crystalline surface texture indicating insufficient heat during soldering

A cold solder joint has a dull, grainy, or crystalline appearance caused by inadequate heat during soldering, resulting in poor wetting and weak mechanical/electrical bonds.

For IPC Class 2, what is the minimum acceptable solder fill percentage for a through-hole component barrel?

Answer: 75%

IPC-A-610 requires a minimum of 75% barrel fill for through-hole solder joints in Class 2 assemblies.