CIS Acceptability Criteria & Defect Recognition Flashcards
6 cards from real CIS practice questions. Tap to flip, then mark Knew It or Still Learning — missed cards come back until you master them.
Read the first 6 CIS Acceptability Criteria & Defect Recognition flashcards as text
What does 'non-wetting' mean in solder joint evaluation?
Answer: A condition where molten solder fails to adhere to a base metal surface
Non-wetting is the failure of molten solder to bond to the base metal surface, typically caused by contamination, oxidation, or inadequate flux.
For IPC-A-610 Class 3, what is the acceptability status of a pinhole or blowhole in a solder joint?
Answer: Defect
Pinholes and blowholes in solder joints are defects for Class 3 assemblies because they indicate voiding and potential joint weakness.
According to IPC-A-610, what is the minimum acceptable side overhang for a rectangular SMT chip component on a Class 2 assembly?
Answer: Up to 25% of the land width
For Class 2, side overhang is acceptable up to 25% of the applicable land width or component end cap width, whichever is less.
What is a 'measling' defect on a printed circuit board?
Answer: White spots or crosses below the surface of the base laminate caused by separation of glass fibers from the resin
Measling appears as white spots or crosses beneath the laminate surface, caused by the separation of glass fibers from the resin binder, typically from thermal or mechanical stress.
IPC-A-610 defines 'minimum electrical clearance' violations as:
Answer: Defects for all classes
Any violation of minimum electrical clearance between conductors is a defect for all IPC classes because it creates a risk of arcing, shorts, or dielectric breakdown.
What is the correct interpretation of a 'target condition' in IPC-A-610?
Answer: The ideal, preferred condition showing a high degree of workmanship
A target condition in IPC-A-610 represents the ideal, preferred result demonstrating a high degree of workmanship — it is not the minimum acceptable standard.