CCT Surface Preparation & Bonding Flashcards
6 cards from real CCT practice questions. Tap to flip, then mark Knew It or Still Learning — missed cards come back until you master them.
Read the first 6 CCT Surface Preparation & Bonding flashcards as text
What adhesive form is most often used for structural composite bonding in aerospace applications?
Answer: Film adhesive (e.g., Redux or EA9696)
Film adhesives provide uniform bondline thickness and consistent mechanical properties critical for aerospace structures.
What is bondline thickness, and why is it controlled during adhesive bonding?
Answer: The cured adhesive gap between adherends; controlled to ensure designed strength and prevent starved or thick bonds
Too thin a bondline (starved) reduces strength, while too thick reduces stiffness and increases void content.
What is the function of a bond fixture or tooling during adhesive cure?
Answer: To maintain part geometry and apply uniform pressure during cure
Bond fixtures hold mating parts in alignment and apply the clamping pressure needed for proper adhesive flow and cure.
During a co-bond operation, what is being joined?
Answer: A cured laminate to an uncured laminate using adhesive, cured simultaneously
In co-bonding, one part is already cured and the other (with or without film adhesive) is cured in the same cycle.
What type of failure mode indicates that the adhesive was stronger than the surface preparation?
Answer: Adhesive failure at the bondline interface
Adhesive (interfacial) failure means the adhesive separated from the substrate surface, indicating poor surface prep.
Which environmental condition most negatively impacts adhesive bond strength during cure?
Answer: High humidity causing moisture contamination at the bondline
Moisture at the bondline can prevent proper adhesive wetting and cause hydrolytic degradation of the bond.